In a recent update, renowned analyst Ming-Chi Kuo revealed that Apple has postponed plans to incorporate Resin Coated Copper (RCC) components in future iPhone models. 9to5Mac).
The move to RCC components was initially expected to debut with the iPhone 16, but was then postponed to the iPhone 17, and now it appears to have been postponed again.
First mentioned in a report by Kuo back in October last year, RCC technology has the potential to revolutionize the internal design of the iPhone: RCC components could reduce the thickness of the mainboard, creating more internal space within the device.
This additional space allows Apple to make the iPhone thinner and introduce new features without increasing the size of the device. Additionally, RCC's glass-fiber-free construction simplifies the drilling process, providing significant manufacturing advantages.
Despite the promising benefits, Apple and its suppliers face significant obstacles in integrating RCC components. The main concerns are the durability and brittleness of the new materials. These issues have repeatedly slowed the adoption of RCC technology.
According to Kuo, the delay is due to the inability of RCC parts to meet Apple's strict quality standards, which means that the iPhone 17, scheduled for release in 2025, will not use RCC mainboard material.
Update: In order to fully meet Apple's high quality standards, the 2025 new iPhone 17 will not use RCC artificial PCB main panel material.
—Update: The new iPhone 17, coming in 2025, will not use RCC as a PCB motherboard material as it cannot meet Apple's high quality requirements. https://t.co/ZInZnDqQqZ
— Ming-Chi Kuo (@mingchikuo)
Kuo's latest report doesn't clarify whether the RCC component will be introduced in the iPhone 18 in 2026 or if there will be a longer delay.